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XPG LANCER BLADE memory module 16 GB 1 x 16 GB DDR5 6000 MT/s 288-pin DIMM ECC
16 GB, DDR5, 6000 MT/s, 1.35 V, CL 30, XMP 3.0, AMD EXPO, ECC, Black
£298.14
£248.45
Availability:
In Stock
SKU
AX5U6000C3016G-SLABBK
- Compact Low-Profile Heatsink Design
- PMIC for power supply stability
- On-die ECC error correction
- High-quality materials for stable overclocking
- Works with the Latest AMD Platforms
- Supports Intel® XMP 3.0 and AMD EXPO for easy overclocking
| Memory | |
|---|---|
| Package type | Blister |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 30 |
| Memory voltage | 1.35 V |
| ECC | Yes |
| Internal memory type | DDR5 |
| Power | |
| Memory voltage | 1.35 V |
| Design | |
| Cooling type | Heatsink |
| Technical details | |
| Cooling type | Heatsink |
| Features | |
|---|---|
| On-Die ECC | Yes |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 30 |
| Memory voltage | 1.35 V |
| Cooling type | Heatsink |
| ECC | Yes |
| Internal memory type | DDR5 |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Memory data transfer rate | 6000 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -20 - 65 °C |
| Weight & dimensions | |
| Package width | 70 mm |
| Package depth | 170 mm |
| Package height | 12.2 mm |
| Width | 133.3 mm |
| Depth | 33.8 mm |
| Height | 7.8 mm |
| Weight | 32.92 g |
| Package type | Blister |
| Package weight | 51.64 g |
| Packaging data | |
| Package width | 70 mm |
| Package depth | 170 mm |
| Package height | 12.2 mm |
| Package type | Blister |
| Package weight | 51.64 g |